Stress Simulation - メーカー・企業と製品の一覧

Stress Simulationの製品一覧

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WTI Heat and Stress Clinic - Heat and Stress Simulation (Analysis)

If a product has a defect, let's consult a specialist (expert) and take measures! Simulation, analysis.

"Troubles have occurred with development and mass-produced products. I want to quickly identify the cause and implement countermeasures." "I want to understand the necessity and methods of heat dissipation measures." By receiving diagnostic results and solutions for defects from specialists in heat and stress, you can resolve issues in a short period of time. (Simulation, analysis) By utilizing this before product prototyping, it is possible to know in advance the "preventive measures" to prevent product troubles related to heat and stress. By implementing development in line with these "preventive measures," you can significantly avoid troubles occurring towards the end of the development period, design revisions, and the resulting time losses. [Features] ■ Understanding actual products and providing analysis results ■ Offering solutions that combine various technologies ■ Possessing a unique semiconductor thermal resistance measurement technology developed based on the structure and thermal characteristics of semiconductors *For more details, please refer to the PDF document or feel free to contact us.

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Stress simulation service (analysis) vibration, shock, drop, durability

Are you struggling to respond to issues related to temperature cycle testing of products? (Analysis) Vibration, shock, drop, durability.

The "Stress Simulation Service" uses a model that takes package structure into account to improve lifespan in temperature cycle testing. (Analysis) Vibration, impact, drop, durability In temperature cycle simulations, lifespan predictions are made considering the package structure, and improvement proposals aimed at reliability are suggested. Additionally, the vibration simulation addresses issues caused by vibrations during transport and operation, while the drop and impact simulation resolves problems related to drop impacts on semiconductor component connections. 【Features】 ■ Improvement of lifespan in temperature cycle testing using a model that considers package structure ■ Reduction of loss costs in the range of one million yen caused by additional prototypes and evaluations ■ Resolution of issues caused by vibrations during transport and operation (actual usage conditions) ■ Resolution of issues related to drop impacts on semiconductor component connections (solder) *For more details, please refer to the PDF document or feel free to contact us.

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